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HSDL-3020
IrDA(R) Data Compliant Low Power 4.0 Mbit/s with Remote Control Infrared Transceiver
Data Sheet
Description The HSDL-3020 is a new generation low profile high speed enhanced infrared (IR) transceiver module that provides the capability of (1) interface between logic and IR signals for through-air, serial, half-duplex IR data link, and (2) IR remote control transmission operating at the optimum 940 nm wavelength for universal remote control applications. The HSDL-3020 features an enhanced 3 lens optical package for optimized IrDA and RC performance. The module is fully compliant to IrDA(R) Physical Layer specifi-cation version 1.4 low power from 9.6 kbit/s to 4.0 Mbit/s (FIR) and IEC825 Class 1 eye safety standards. The HSDL-3020 can be shutdown completely to achieve very low power consumption. In the shutdown mode, the PIN diode will be inactive and thus producing very little photocurrent even under very bright ambient light. It is also designed to interface to input/output logic circuits as low as 1.5 V. These features are ideal for battery operated mobile devices such as PDAs and mobile phones that require low power consumption.
Features General Features * Enhanced optical 3 lens design for optimized IrDA and RC performance * Operating temperature from -25C ~ 85C - Critical parameters are guaranteed over temperature and supply voltage * VCC supply 2.4 to 3.6 volts * Miniature package - Height: 2.5 mm - Width: 10.4 mm - Depth: 2.95 mm * Integrated remote control LED driver * Input/output interface voltage of 1.5 V * Integrated EMI shield * LED stuck-high protection * Designed to accommodate light loss with cosmetic windows * IEC 825-Class 1 eye safe * LED stuck high protection * Interface to various super I/O and controller devices * Lead free package IrDA Features * Fully compliant to IrDA 1.4 Physical Layer Low Power Specifications from 9.6 kbit/s to 4.0 Mb/s - Link distance up to 50 cm typically * Complete shutdown for TxD_IrDA, RxD_IrDA and PIN diode * Low power consumption - Low shutdown current
Remote Control Features * Wide angle and high radiant intensity * Spectrally suited to remote control transmission function at 940 nm typically * Typical link distance up to 14 meters (on-axis) Applications * Mobile data communication and universal remote control - Mobile phones - PDAs - Webpads
GND
10 Rx PULSE SHAPER
TxD_RC CX1 VCC R1 SD CX2 VCC
9
8
7
RxD
6
TxD_IR CX5 IOVCC CX4 R2 IR VLED R3 RC VLED CX6 CX7 IOVCC
5 IR LED DRIVER 4
CX3
IR_LEDA
3
RC_LEDA
2
RC LED DRIVER
RC_LEDC
1
Figure 1. Functional block diagram of HSDL-3020.
10
9
8
7
6
5
4
3
2
1
Figure 2. Rear view diagram with pinout.
Application Support Information The Application Engineering Group is available to assist you with the application design associated with HSDL-3020 infrared transceiver module. You can contact them through your local sales representatives for additional details.
Order Information Part Number HSDL-3020-021 Packaging Type Tape and Reel Package Front Option Quantity 2500
Marking Information The unit is marked with "7YWLL" on the shield Y = Year W = Work week LL = Lot information
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SHIELD
I/O Pins Configuration Table Pin 1 2 3 4 5 6 7 8 9 10 - Symbol RC_LEDC RC_LEDA IR_LEDA IOVCC TxD_IR RxD SD VCC TxD_RC GND Shield Description RC LED Cathode RC LED Anode IR LED Anode Input/Output ASIC Voltage IrDA Transmitter Data Input IrDA Receive Data Shutdown Supply Voltage RC Transmitter Data Input Ground EMI Shield Input. Active High Input. Active High Output. Active Low Input. Active High I/O Type Notes Note 1 Note 2 Note 3 Note 4 Note 5 Note 6 Note 7 Note 8 Note 9 Note 10 Note 11
Notes: 1. Internally connected to RC LED driver. Leave this pin unconnected. 2. Tied through external resistor, R3, to RC Vled. Refer to the table below for recommended series resistor value. 3. Tied through external resistor, R2, to IR Vled. Refer to the table below for recommended series resistor value. 4. Connect to ASIC logic controller supply voltage or VCC. The voltage at this pin should be equal to or less than VCC. 5. This pin is used to transmit serial data when SD pin is low. If held high for longer than 50 s, the LED is turned off. Do NOT float this pin. 6. This pin is capable of driving a standard CMOS or TTL load. No external pull-up or pull-down resistor is required. The pin is in tri-state when the transceiver is in shutdown mode. 7. Complete shutdown of IC and PIN diode. The pin is used for setting receiver bandwidth and RC drive programming mode. Refer to section on "Bandwidth Selection Timing" and "Remote Control Drive Modes" for more information. Do NOT float this pin. 8. Regulated, 2.4 V to 3.6 V. 9. Logic high turns on the RC LED. If held high longer than 50 s, the RC LED is turned off. Do NOT float this pin. 10. Connect to system ground. 11, Connect to system ground via a low inductance trace. For best performance, do not connect directly to the transceiver GND pin.
CAUTIONS: The BiCMOS inherent to the design of this component increases the component's susceptibility to damage from electrostatic discharge (ESD). It is advised that normal static precautions be taken in handling and assembly of this component to prevent damage and/or degradation which may be induced by ESD.
3
Recommended Application Circuit Components Component R1 R2 Recommended Value 4.7 , 5%, 0.25 watt for VCC 3.6 V 4.7 for 2.4 V VLED < 2.7 V 6.8 for 2.7 V VLED < 3 V 10 for 3 V VLED < 3.3 V 13 for 3.3 V VLED < 3.6 V 15 for 3.6 V VLED < 4.2 V 20 for 4.2 V VLED < 5 V 1.8 for 2.4 V VLED < 2.7 V 2.7 for 2.7 V VLED < 3 V 3.3 for 3 V VLED < 3.3 V 3.9 for 3.3 V VLED < 3.6 V 4.7 for 3.6 V VLED < 4.2 V 6.2 for 4.2 V VLED < 4.7 V 6.8 for 4.7 V VLED < 5 V 100 nF, 20%, X7R Ceramic 4.7 F, 20%, Tantalum 1 1 Note
R3
CX1, CX3, CX5, CX6 CX2, CX4, CX7
Note: 1. CX1, CX2, CX3, CX4, CX5, CX6 & CX7 must be placed within 0.7 cm of HSDL-3020 to obtain optimum noise immunity.
Absolute Maximum Ratings For implementations where case to ambient thermal resistance is 50C/W. Parameter Storage Temperature Operating Temperature LED Anode Voltage Supply Voltage Input Voltage: TxD, SD/Mode Input/Output Supply Voltage RC LED Current IR LED Current Symbol TS TA VLEDA VCC VI IOVCC RC ILED IR ILED Min. -40 -25 0 0 0 0 Max. +100 +85 6.5 6 5.5 6 500 190 Units C C V V V V mA mA Conditions
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Recommended Operating Conditions Parameter Operating Temperature Supply Voltage Input/Output Voltage Logic Input Voltage for TXD, SD/Mode Logic High Logic Low Symbol TA VCC IOVCC VIH VIL Min. -25 2.4 1.5 IOVCC - 0.5 0 0.0090 Receiver Input Irradiance Logic High EIH 0.0225 Logic Low LED (Logic High) Current Pulse Amplitude - SIR Mode LED (Logic High) Current Pulse Amplitude - MIR/FIR Mode LED (Logic High) Current Pulse Amplitude - RC Mode Receiver Data Rate Ambient Light EIL IR_ILEDA 70 500 0.3 W/cm2 mA Typ. Max. +85 3.6 3.6 IOVCC 0.5 500 mW/cm2 Units C V V V V For in-band signals 115.2 kbit/s[3] 0.576 Mbit/s in-band signals 4.0 Mbit/s[3] For in-band signals[3] IR VLED = 3.6, R = 15 , 20% duty cycle, 90 s pulse width IR VLED = 3.6, R = 15 , 25% duty cycle, 90 s pulse width RC VLED = 3.6, R = 3.9 , 25% duty cycle, 90 s pulse width See IrDA Serial Infrared Physical Layer Link Specification, Appendix A for ambient levels Conditions
IR_ILEDA
120
mA
RC_ILEDA
420
mA
0.0096
4.0
Mbit/s
Note: 3. An in-band optical signal is a pulse/sequence where the peak wavelength, lp, is defined as 850 lp 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification v1.4.
5
Electrical and Optical Specifications Specifications (Min. & Max. values) hold over the recommended operating conditions unless otherwise noted. Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25C with VCC set to 3.0 V and IOVCC set to 1.8 V unless otherwise noted. Parameter Receiver Viewing Angle Peak Sensitivity Wavelength RxD_IrDA Output Voltage Logic High Logic Low RxD_IrDA Pulse Width RxD_IrDA Pulse Width (SIR)[4] (MIR)[4] 2q1/2 lP VOH VOL tRPW(SIR) tRPW(MIR) tRPW(FIR) tRPW(FIR) tr, tf tL tRW IEH 4 IOVCC - 0.5 0 1 100 80 200 40 100 200 30 875 IOVCC 0.4 4 500 175 290 nm V V s ns ns ns ns s s mW/sr q1/2 15, CL = 9 pF q1/2 15, CL = 9 pF q1/2 15, CL = 9 pF q1/2 15, CL = 9 pF CL = 9 pF EI = 9.0 W/cm2 EI = 10 W/cm2 IR_ILEDA = 70 mA, q1/2 15, TxD_IR VIH, TA = 25C IR_ILEDA = 120 mA, q1/2 15, TxD_IR VIH, TA = 25C IOH = -200 A, EI 0.3 W/cm2 Symbol Min. Typ. Max. Units Conditions
RxD_IrDA Pulse Width (Single) (FIR)[4] RxD_IrDA Pulse Width (Double) (FIR)[4] RxD_IrDA Rise & Fall Times Receiver Latency Time[5] Receiver Wake Up Time[6] Infrared (IR) Transmitter IR Radiant Intensity (SIR Mode)
IR Radiant Intensity (MIR/FIR Mode)
IEH
10
mW/sr
IR Viewing Angle IR Peak Wavelength TxD_IrDA Logic Levels High Low TxD_IrDA Input Current Time[7] Width[8] High Low Wake Up
2q1/2 lP VIH VIL IH IL tTW tPW(Max) tPW(SIR) tPW(MIR) tPW(FIR) tr, tf
30 875 IOVCC - 0.5 0 0.02 -0.02 180 25 1.6 217 125
60 IOVCC 0.5
nm V V A A ns VI VIH 0 VI VIL
Maximum Optical Pulse TxD Pulse Width (SIR) TxD Pulse Width (MIR) TxD Pulse Width (FIR)
50
s s ns ns tPW (TxD_IR) = 1.6 s at 115.2 kbit/s tPW (TxD_IR) = 217 ns at 1.152 Mbit/s tPW (TxD_IR) = 125 ns at 4.0 Mbit/s tPW (TxD_IR) = 1.6 s at 115.2 kbit/s tPW (TxD_IR) = 125 ns at 4.0 Mbit/s
TxD Rise & Fall Times (Optical)
600 40
ns ns
6
Electrical and Optical Specifications (Cont'd.) Parameter IR LED Anode On-State Voltage (SIR Mode) IR LED Anode On-State Voltage (MIR/FIR Mode) Remote Control (RC) Transmitter RC Radiant Intensity IEH 110 mW/sr RC_ILEDA = 420 mA, q1/2 15, TxD_RC VIH, TA = 25C Symbol VON
(IR_LEDA)
Min.
Typ. 2.5
Max.
Units V
Conditions IR_ILEDA = 70 mA, IR VLED = 3.6 V, R = 15 , VI (TxD) VIH IR_ILEDA = 120 mA, IR VLED = 3.6 V, R = 15 , VI(TxD_IR) VIH
VON
(IR_LEDA)
1.9
V
RC Viewing Angle RC Peak Wavelength TxD_RC Logic Levels High Low TxD_RC Input Current High Low RC LED Anode On-State Voltage
2q1/2 lP VIH VIL IH IL VON
(RC_LEDA)
30 940 IOVCC - 0.5 0 0.02 -0.02 2.0
60 IOVCC 0.5 1 1
nm V V A A V VI VIH 0 VI VIL RC_ILEDA = 420 mA, RC VLED = 3.6 V, R = 3.9 , VI(TxD_RC) VIH VI VIH 0 VI VIL VSD VCC - 0.5, TA = 25C VI(TxD) VIL, EI = 0 VI(TxD) VIL, EI = 10 mW/cm2
Transceiver Input Current High Low Supply Current IH IL ICC2 ICC3 -1 0.01 -0.02 1 1 1 2.0 3.5 2.9 A A A mA mA
Shutdown ICC1 Idle (Standby) Active
Notes: 4. An in-band optical signal is a pulse/sequence where the peak wavelength, lP, is defined as 850 nm lP 900 nm, and the pulse characteristics are compliant with the IrDA Serial Infrared Physical Layer Link Specification version 1.4. 5. For in-band signals 9.6 kbit/s to 115.2 kbit/s where 9 W/cm2 EI 500 mW/cm2. 6. Latency is defined as the time from the last TxD_IrDA light output pulse until the receiver has recovered full sensitivity. 7. Receiver Wake Up Time is measured from VCC power ON to valid RxD_IrDA output. 8. Transmitter Wake Up Time is measured from VCC power ON to valid light output in response to a TxD_IrDA pulse. 9. The Optical PW is defined as the maximum time in which the IR LED will turn on. This is to prevent the long Turn On time for the IR LED.
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IR SIR Mode - VLED_A vs ILED
2.3 2.2
IR MIR/FIR Mode - VLED_A vs ILED
1.80 1.75
2.1
VLED_A (V)
1.9 1.8 1.7 1.6
VLED_A (V)
2.0
1.70 1.65 1.60 1.55
1.5 1.4 0 0.02 0.04 0.06 0.08 0.10 0.12
1.50 0.05
0.075
0.10
0.125
0.15
0.175
ILED (A)
ILED (A)
IR SIR Mode - Radiant Intensity vs ILED
20
36
IR MIR/FIR Mode - Radiant Intensity vs ILED
RADIANT INTENSITY (mW/sr)
RADIANT INTENSITY (mW/sr)
0 0.02 0.04 0.06 0.08 0.10 0.12
18 16 14 12 10 8 6 4 2 0
33 30 27 24 21 18 15 0.05
0.075
0.10
0.125
0.15
0.175
ILED (A)
ILED (A)
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HSDL-3020 Package Dimensions
MOUNTING CENTER
5.20
1.025
10.40 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. RC CATHODE RC VLED IR VLED IOVCC TxD IR RxD SD VDD TxD RC GND
2.50 1.15 1.20 3.60 RC EMITTER DA EMITTER R2.10 5.10 RECEIVER 1.20
R1.10 0.95
R1.10
R1.10 1.50 2.95 0.70
1 1.80 COPLANARITY 0.00 TO 0.20 mm 0.68
2
3
4
5
6
7
8
9
10
PITCH 0.95
0.60
0.50
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HSDL-3020 Tape and Reel Dimensions
D0
P0
P2
2 0.1 B E 5(MAX.) F W B0
T
A
A
B P1 A0 5(MAX.) D1
K0 SECTION B-B
SECTION A-A
SYMBOL SPEC. SYMBOL SPEC.
A0 2.95 0.10 E 1.75 0.10
B0 10.65 0.10 F 11.5 0.10
K0 2.77 0.10 D0 1.55 0.05
P0 4.0 0.10 D1 1.50 0.10
P1 8.0 0.10 W 24.0 0.30
P2 2.4 0.10 10P0 40.0 0.20
T 0.35 0.10
NOTES: 1. 10 SPROCKET HOLE PITCH CUMULATIVE TOLERANCE IS 0.2 mm. 2. CARRIER CHAMBER SHALL BE NOT MORE THAN 1 mm PER 100 mm THROUGH A LENGTH OF 250 mm. 3. A0 AND B0 MEASURED ON A PLACE 0.3 mm ABOVE THE BOTTOM OF THE POCKET. 4. K0 MEASURED FROM A PLACE ON THE BOTTOM OF THE POCKET IN TOP SURFACE OF CARRIER. 5. POCKET POSITION RELATIVE TO SPROCKET HOLE MEASURED AS TRUE POSITION OF POCKET, NOT POCKET HOLE.
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HSDL-3020 Moisture Proof Packaging All HSDL-3020 options are shipped in moisture proof package. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4.
Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Package In reels In bulk Temp. 60C 100C 125C 150C Time 48 hours 4 hours 2 hours 1 hour
UNITS IN A SEALED MOISTURE-PROOF PACKAGE
Baking should only be done once. Recommended Storage Conditions
PACKAGE IS OPENED (UNSEALED)
Storage Temperature 10C to 30C Relative Humidity Below 60% RH
ENVIRONMENT LESS THAN 30C, AND LESS THAN 60% RH
Time from Unsealing to Soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions.
YES
NO BAKING IS NECESSARY
YES
PACKAGE IS OPENED MORE THAN 72 HOURS
NO
PERFORM RECOMMENDED BAKING CONDITIONS
NO
Figure 3. Baking conditions chart.
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Recommended Reflow Profile
MAX. 260C R3 R4
255 230 220 200 180 160 120 80 25 0 P1 HEAT UP 50 100 P2 SOLDER PASTE DRY 150 R1
T - TEMPERATURE - (C)
R2
60 sec. MAX. ABOVE 220C
R5
200 P3 SOLDER REFLOW
250 P4 COOL DOWN
300
t-TIME (SECONDS)
Process Zone Heat Up Solder Paste Dry Solder Reflow Cool Down
Symbol P1, R1 P2, R2 P3, R3 P3, R4 P4, R5
DT 25C to 160C 160C to 200C 200C to 255C (260C at 10 seconds max) 255C to 200C 200C to 25C
Maximum DT/Dtime 4C/s 0.5C/s 4C/s -6C/s -6C/s
The reflow profile is a straightline representation of a nominal temperature profile for a convective reflow solder process. The temperature profile is divided into four process zones, each with different DT/Dtime temperature change rates. The DT/Dtime rates are detailed in the above table. The temperatures are measured at the component to printed circuit board connections. In process zone P1, the PC board and HSDL-3020 castellation pins are heated to a temperature of 160 C to activate the flux in the solder paste. The temperature ramp up rate, R1, is limited to 4 C per second to allow for even heating of both the PC board and HSDL-3020 castellations.
Process zone P2 should be of sufficient time duration (60 to 120 seconds) to dry the solder paste. The temperature is raised to a level just below the liquidus point of the solder, usually 200 C (392 F). Process zone P3 is the solder reflow zone. In zone P3, the temperature is quickly raised above the liquidus point of solder to 255 C (491 F) for optimum results. The dwell time above the liquidus point of solder should be between 20 and 60 seconds. It usually takes about 20 seconds to assure proper coalescing of the solder balls into liquid solder and the formation of good solder connections. Beyond a dwell time of 60 seconds, the intermetallic growth within the
solder connections becomes excessive, resulting in the formation of weak and unreliable connections. The temperature is then rapidly reduced to a point below the solidus temperature of the solder, usually 200 C (392 F), to allow the solder within the connections to freeze solid. Process zone P4 is the cool down after solder freeze. The cool down rate, R5, from the liquidus point of the solder to 25 C (77 F) should not exceed 6 C per second maximum. This limitation is necessary to allow the PC board and HSDL-3020 castellations to change dimensions evenly, putting minimal stresses on the HSDL3020 transceiver.
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Appendix A: HSDL3020 SMT Assembly Application Note Solder Pad, Mask and Metal Stencil
METAL STENCIL FOR SOLDER PASTE PRINTING
STENCIL APERTURE
LAND PATTERN
SOLDER MASK PCBA
Figure 1. Stencil and PCBA.
Recommended Land Pattern
MOUNTING CENTER
2.7
1.25 2.05 0.35
0.10 0.775 1.75
FIDUCIAL 0.475 1.425 SYMETRICAL CENTER
Figuure 2.
13
Recommended Metal solder Stencil Aperture It is recommended that only a 0.152 mm (0.006 inch) or a 0.127 mm (0.005 inch) thick stencil be used for solder paste printing. This is to ensure adequate printed solder paste volume and no shorting. See Table 1, below the drawing, for combinations of metal stencil aperture and metal stencil thickness that should be used. Aperture opening for shield pad is 3.05 mm x 1.1 mm as per land pattern.
APERTURES AS PER LAND DIMENSIONS
t
w l
Figure 3. Solder stencil aperture.
Table 1. Aperture Size (mm) Stencil Thickness, t (mm) 0.127 mm 0.11 mm Length, l 1.75 0.05 2.4 0.05 Width, w 0.55 0.05 0.55 0.05
Adjacent Land Keepout and Solder Mask Areas Adjacent land keepout is the maximum space occupied by the unit relative to the land pattern. There should be no other SMD
components within this area. The minimum solder resist strip width required to avoid solder bridging adjacent pads is 0.2 mm. It is recommended that two fiducial crosses be placed at
mid length of the pads for unit alignment.
Note: Wet/Liquid Photo-imageable solder resist/mask is recommended.
j
h
k
DIMENSION h l SOLDER MASK l k j
mm 0.2 3.0 3.85 11.9
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Appendix B: PCB Layout Suggestion The effects of EMI and power supply noise can potentially reduce the sensitivity of the receiver, resulting in reduced link distance. The PCB layout played an important role to obtain a good PSRR and EM immunity resulting in good electrical performance. Things to note: 1. The ground plane should be continuous under the part, but should not extend under the shield trace. 2. The shield trace is a wide, low inductance trace back to the system ground. CX1, CX2, CX3, CX4, CX5, CX6 and CX7 are optional supply filter capacitors; they may be left out if a clean power supply is used. 3. IR and RC VLED can be connected to either unfiltered or unregulated power supply. The bypass capacitors should be connection before the current limiting resistor R3
and R4 respectively. In a noisy environment, including capacitor CX2 and CX7 can enhance supply rejection. CX6 and CX3 that are generally a ceramic capacitor of low inductance providing a wide frequency response while CX2 and CX4 are tantalum capacitor of big volume and fast frequency response. The use of a tantalum capacitor is more critical on the VLED line, which carries a high current. 4. VCC pin can be connected to either unfiltered or unregulated power supply. The Resistor, R1 together with the capacitors, CX1 and CX2 acts as the low pass filter. 5. IOVCC is connected to the ASIC voltage supply or the VCC supply. The capacitor, CX5 acts as the bypass capacitor. 6. Preferably a multi-layered board should be used to provide sufficient ground plane. Use the layer underneath and near the
transceiver module as VCC, and sandwich that layer between ground connected board layers. The diagram below demonstrate an example of a 4 layer board: * Top Layer: Connect the metal shield and module ground pin to bottom ground layer; Place the bypass capacitors within 0.5cm from the VCC and ground pin of the module. * Layer 2: Critical ground plane zone. 3 cm in all direction around the module. Connect to a clean, noiseless ground node (eg bottom layer). * Layer 3: Keep data bus away from critical ground plane zone. * Bottom layer: Ground layer. Ground noise <75 mVp-p. Should be separated from ground used by noisy sources.
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NOISE SOURCES TO BE PLACED AS FAR AWAY FROM THE TRANSCEIVER AS POSSIBLE TOP LAYER
CX6 CX7
R 2
CX4 CX5 CX3
CX1 R 1 CX2
LAYER 3
R 3
LAYER 3
LEGEND: GROUND VIA BOTTOM LAYER (GND)
The area underneath the module at the second layer, and 3 cm in all directions around the module, is defined as the critical ground plane zone. The ground plane should be maximized in this zone.
Refer to application note AN1114 or the Avago IrDA Data Link Design Guide for details. The layout below is based on a 2-layer PCB.
Top Layer
Bottom Layer
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Appendix C: General Application Guide for the HSDL-3020 Infrared IrDA Compliant 4 Mb/s Transceiver Description The HSDL-3020, a wide-voltage operating range infrared transceiver is a low-cost and small form factor device that is designed to address the mobile computing market such as PDAs, as well as small embedded mobile products such as digital cameras and cellular phones. It is spectrally suited to universal remote control transmission function at 940 nm typically. It is fully compliant to IrDA 1.4 low power specification up 4 Mb/s and supports most remote control codes. The design of HSDL-3020
also includes the following unique features: * Spectrally suited to universal remote control transmission function at 940 nm typically * Low passive component count * Shutdown mode for low power consumption requirement * Direct interface with I/O logic circuit Selection of Resistor R2 and R3 Resistor R2 and R3 should be selected to provide the appropriate peak pulse IR and RC LED current respectively at different ranges of VCC as shown on page 4 under "Recommended Application Circuit Components."
Interface to the Recommended I/O Chip The HSDL-3020's TxD data input is buffered to allow for CMOS drive levels. No peaking circuit or capacitor is required. Data rate from 9.6 kb/s to 4 Mb/s is available at RxD pin. The TxD_RC, pin 2, together with RC_LEDA, pin 9, is used to select the remote control transmit mode. Alternatively, the TxD_IR, pin 6, together with IR_LEDA, pin 8, is used for infrared transmit selection. Following shows the hardware reference design with HSDL-3020. *Detailed configuration of HSDL3020 with the controller chip is shown in Figure 3.
STN/TFT LCD PANEL
KEY PAD
TOUCH PANEL
LCD CONTROL A/D
PERIPHERIAL INTERFACE PWM
LCD BACKLIGHT CONTRAST *HSDL-3020
MOBILE APPLICATION CHIPSET
IrDA INTERFACE
AC97 SOUND MEMORY EXPANSION LOGIC BUS DRIVER MEMORY I/F BASEBAND I2S CONTROLLER
PCM SOUND AUDIO INPUT
ROM FLASH SDRAM
POWER MANAGEMENT
ANTENNA
Figure 2: Mobile application platform.
The use of the infrared tech- niques for data communication has increased rapidly lately and almost all mobile application processors have built in the IR port. This does away with the external Endec and simplifies the interfacing to a direct connection between the processor and the transceiver. The next section discusses interfacing configuration with a general processor.
17
General Mobile Application Processor
VCC CX1 R1 CX2 IOVCC RC_VLED GND
VCC IOVCC GPIO R3 RC_VLEDA 100 kW CX6 CX7 CX5 IOVCC TxD_RC
GND
HSDL-3020
GND IR_RxD GPIO IR_TxD IR_VLED R2 100 kW IR_VLEDA RC LED CATHODE CX3 CX4 NC GND GND RXD SD TxD_IR
The transceiver is directly interfaced with the microprocessor provided its support infrared communication commonly known as Infrared Communications Port (ICP). The ICP supports both SIR data rates, with up to 115.2 kps, and sometimes FIR data, with data rates up to 4 Mbps. The remote control commands can be sent to one of the available General Purpose IO pins or the UART block with IrDA functionality. It should be observed that although both IrDA data transmission and Remote control transmission is possible simultaneously by the hardware, the software is required to resolve this issue to prevent the mixing and corruption of data while being transmitted over the free air. The above Figure 3 illustrates a reference interfacing to implement both IR and RC functionality with HSDL-3020.
Figure 3: HSDL-3020 configuration with general mobile architecture processor.
Remote Control Operation The HSDL-3020 is spectrally suited to universal remote control transmission function at 940 nm typically. Remote control applications are not governed by any standards, owing to which there are numerous remote codes in market. Each of those standards results in receiver modules with different sensitivities, depending on the carrier frequencies and responsively to the incident light wavelength. Remote control carrier frequencies are in the range of 30 KHz to 60 KHz (for details of some the frequently
used carrier frequencies, please refer to AN1314). Some common carrier frequencies and the corresponding SA-1110 UART frequency and baud rate divisor are shown in Table 3.
Table 3. Remote Control Carrier Frequency (kHz) 30 32, 33 36, 36.7, 38, 39.2, 40 56 SA-1110 UART Frequency (kHz) 28.8 32.9 38.4 57.6 Baud Rate Divisor 8 7 6 4
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Appendix D: Window Design for HSDL-3020 To ensure IrDA compliance, some constraints on the height and width of the window exist. The minimum dimensions ensure that the IrDA cones angles are met without vignetting. The maximum dimensions minimize the effects of stray light. The minimum size corresponds to a cone angle of 30 and the maximum size corresponds to a cone angle of 60.
OPAQUE MATERIAL
IR TRANSPARENT WINDOW
Y
X
Z
OPAQUE WINDOW
T
Z
IR TRANSPARENT WINDOW
In the figure above, X is the width of the window, Y is the height of window, Z is the distance from the HSDL-3020 to the back of the window, and T is the thickness of the IR transparent window.
Module Depth, Z (mm) 0.5 1.0 2.0 3.0 4.0 5.0
Min. Aperture Width, X (mm) 11.00 11.50 12.25 12.80 13.25 14.00
Min. Aperture Height, Y (mm) 3.00 3.25 3.75 4.50 5.20 6.00
Max. IR Window (mm) 1.0 1.0 1.0 1.0 1.0 1.0
19
APERTURE WIDTH (X) vs. MODULE DEPTH 16 14 12 10 8 6 4 2 0 0 1 2 3 4 5 6 APERTURE HEIGHT (Y) - mm APERTURE WIDTH (X) - mm 7 6 5 4 3 2 1 0 0
APERTURE WIDTH (X) vs. MODULE DEPTH
1
2
3
4
5
6
APERTURE DEPTH (Z) - mm
APERTURE DEPTH (Z) - mm
For the modules depth values that are not shown on the tables above, the minimum X and Y values can be interpolated.
Window Material Almost any plastic material will work as a window material. Polycarbonate is recommended. The surface finish of the plastic should be smooth, without any texture. An IR filter dye may be used in the window to make it look black to the eye, but the
total optical loss of the window should be 10% or less for best optical performance. Light loss should be measured at 875 nm. The recommended plastic materials for use as a cosmetic window are available from General Electric Plastics.
Recommended Plastic Materials: Material # Lexan 141 Lexan 920A Lexan 940A Light Transmission 88% 85% 85% Haze 1% 1% 1% Refractive Index 1.586 1.586 1.586
Note: 920A and 940A are more flame retardant than 141. Recommended Dye: Violet #21051 (IR transmissant above 625 mm)
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Shape of the Window From an optics standpoint, the window should be flat. This ensures that the window will not alter either the radiation pattern of the LED, or the receive pattern of the photodiode. If the window must be curved for mechanical or industrial design reasons, place the same curve on the backside of the window that has an identical radius as the front side. While this
will not completely eliminate the lens effect of the front curved surface, it will significantly reduce the effects. The amount of change in the radiation pattern is dependent upon the material chosen for the window, the radius of the front and back curves, and the distance from the back surface to the transceiver. Once these items are known, a lens design can be made which will eliminate
the effect of the front surface curve. The following drawings show the effects of a curved window on the radiation pattern. In all cases, the center thickness of the window is 1.5 mm, the window is made of polycarbonate plastic, and the distance from the transceiver to the back surface of the window is 3 mm.
Flat Window (First Choice)
Curved Front and Back (Second Choice)
Curved Front, Flat Back (Do not use)
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Appendix E: General Application Guide for the HSDL-3020 Remote Control Drive Modes The HSDL-3020 can operate in the single-TxD programmable mode or the two-TxD direct transmission mode. Single-TxD Programmable Mode In the single-TxD programmable mode, only one input pin (TxD_IR input pin) is used to turn on the
remote control (940 nm) LED while the TxD_RC input pin is grounded. The transceiver is in default mode (IrDA-SIR) when powered up. The user needs to apply the following programming sequence to both the TxD_IR and SD inputs to enable the transceiver to operate in either the IrDA or remote control mode.
tC tTL tA tB tC
SHUTDOWN (ACTIVE HIGH)
tH tH tH
TxIR (ACTIVE HIGH)
***
***
***
SHUTDOWN
DRIVE IrDA LED
RC MODE
DRIVE RC LED
RESET
DRIVE IrDA LED
TxRC (GND)
Mode Programming Timing Table Parameter Symbol Min Typ Max Unit Notes
The following timings describe input constraints required using the active serial interface for mode programming with pins SD, TxIR, and TxRC: Shutdown input pulse width, at pin SD SD mode setup time TxIR pulse width for RC mode SD programming pulse width Note: ( tA + tB ) < tC < tSDPW TxIR setup time for SIR or MIR/FIR mode TxIR or SD hold time to latch SIR, MIR/FIR or RC mode tSDPW tA tB tC tS tH 30 200 200 50 50 5.0 s ns ns s ns ns Will activate complete shutdown Setup for mode programming RC drive enabled with pin TxIR Pulse width mode programming Setup time for IrDA bandwidth selection Hold time for IrDA or RC modes
22
Two-TxD Direct Transmission Mode In the two-TxD direct transmission mode, the IrDA (875 nm) LED and the remote control (940 nm) LED are turned on separately by two different input pins. The TxIR input pin is
used to turn on the IrDA (875 nm) LED while the TxRC input pin is used to turn on the remote control (940 nm) LED. Please refer to the Transceiver I/O truth table for more detail.
Transceiver Control I/O Truth Table for Two-TxD Direct Transmission Mode SD 0 0 0 0 1 TxIR 0 0 1 1 0 TxRC 0 1 0 1 0 IrDA LED OFF OFF ON - OFF RC LED OFF ON OFF - OFF Remarks IR Rx enabled. Idle mode Remote control operation IrDA Tx operation Not recommended (Both Transmitters off) Shutdown mode*
*The shutdown condition will set the transceiver to the default mode (IrDA-SIR)
Bandwidth Selection Timing The power on state should be the IrDA SIR mode. The data transfer rate must be set by a programming sequence using the TxD_IR and SD inputs as described below.
Note: SD should not exceed the maximum, tC 5 s, to prevent shutdown.
Setting to the High Bandwidth MIR/FIR Mode (0.576 Mbits/s to 4 Mbits/s) 1. Set SD input to logic "HIGH." Wait tA 200 ns. 2. Set TxD_IR input to logic "HIGH." Wait tS 50 ns. 3. Set SD to logic "LOW" (this negative edge latches state of TxD_IR, which determines speed setting). 4. After waiting tH 50 ns TxD_IR can be set to logic "LOW." TxD_IR is now reenabled as normal IrDA transmit input for the High Bandwidth MIR/FIR mode.
Setting to the Low Bandwidth SIR Mode (2.4 kbits/s to 115.2 kbits/s) 1. Set SD input to logic "HIGH." 2. Set TxIR input to logic "LOW." Wait tS 50 ns. 3. Set SD to logic "LOW" (this negative edge latches state of TxIR, which determines speed setting). 4. TxIR must be held for tS 50 ns. TxIR is now re-enabled as normal IrDA transmit input for the Low Bandwidth SIR mode.
50%
50% tC
SD
tA
tS
tH
HIGH: MIR/FIR
50%
50%
TxIR
LOW: SIR
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For product information and a complete list of distributors, please go to our website:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2006 Avago Technologies Limited. All rights reserved. Obsoletes 5989-2359EN 5989-4167EN June 28, 2006

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